Inventor
Bong-hui Lee
Inventor
Daejeon, KR
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Nprimary
H04NPictorial communication, e.g. television33%
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
11,076,175Video encoding method for encoding division block, video decoding method for decoding division block, and recording medium for implementing the same20217,119,285'Flexible printed circuit board'20066,838,753'Lead-frame strip and method of manufacturing semiconductor packages using the same'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2006Patents assigned to SAMSUNG TECHWIN CO LTD (2)· patent assignee history
2005Based in Yongin, KR· patent location history
2006Based in Yongin-si, KR· patent location history
2021Patents assigned to KOREA ADVANCED INST SCI & TECH (1)· patent assignee history
2021Patents assigned to KOREAN BROADCASTING SYSTEM (1)· patent assignee history
2021Based in Daejeon, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG TECHWIN CO LTD | 2 | 2005–2006 |
| KOREA ADVANCED INST SCI & TECH | 1 | 2021 |
| KOREAN BROADCASTING SYSTEM | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Daejeon, KR | 1 | 2021 |
| Yongin-si, KR | 1 | 2006 |
| Yongin, KR | 1 | 2005 |