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Inventor

Wolfgang Pahl

Inventor
Munich, DE

Overview

54→
Patents
1989–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 54 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
B81BMicrostructural devices or systems, e.g. micromechanical devices15%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers12%
H03HImpedance networks, e.g. resonant circuits11%
H01LSemiconductor devices10%
Y10TTechnical subjects covered by former us classification9%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems9%
H05KPrinted circuits5%
H10NElectric solid-state devices not otherwise provided for2%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure1%
PatentTitleYear
10,903,156Electronic device with stud bumps202110,683,201Resiliently mounted sensor system with damping202010,544,035Sensor component having two sensor functions202010,542,630Housing for an electric component, and method for producing a housing for an electric component202010,448,530Housing used for electric component and method for manufacturing same201910,194,227Top port microphone and method for the production of same201910,164,166MEMS component and method for encapsulating MEMS components201810,154,582Method for producing a cased electrical component201810,136,226Top-port MEMS microphone and method of manufacturing the same201810,117,027Microphone and method for producing a microphone201810,015,600Multi-MEMS module20189,853,204MEMS component and method for encapsulating MEMS components20179,854,350Microphone having increased rear volume, and method for production thereof20179,844,128'Cased electrical component'20179,718,673'Component which can be produced at wafer level and method of production'20179,676,612'Component which can be produced at wafer level and method of production'20179,647,196'Wafer-level package and method for production thereof'20179,556,022'Method for applying a structured coating to a component'20179,481,565'Encapsulated component comprising a MEMS component and method for the production thereof'20169,331,010'System support for electronic components and method for production thereof'20169,278,854'Method for producing a sensor'20169,084,366'Electric component having a shallow physical shape, and method of manufacture'20159,061,888'Sensor module and method for producing sensor modules'20159,056,760'Miniaturized electrical component comprising an MEMS and an ASIC and production method'20159,051,174'Method for encapsulating an MEMS component'20159,035,189'Circuit board with flexible region and method for production thereof'20158,865,499'MEMS microphone and method for producing the MEMS microphone'20148,713,789'Method of manufacturing a microphone'20148,674,464'MEMS component, method for producing a MEMS component, and method for handling a MEMS component'20148,611,566'MEMS-microphone'20138,582,788'MEMS microphone'20138,571,239'MEMS microphone'20138,531,018'Component comprising a chip in a cavity and a stress-reduced attachment'20138,432,007'MEMS package and method for the production thereof'20138,294,535'Electrical component and production method'20128,229,139'MEMS microphone, production method and method for installing'20128,218,794'Component comprising a MEMS microphone and method for the production of said component'20128,184,845'Electrical module comprising a MEMS microphone'20128,169,041'MEMS package and method for the production thereof'20128,098,001'Component with reduced temperature response, and method for production'20127,218,189'SAW component with adhesive location and use thereof'20077,102,224'Encapsulated component and method for the production thereof'20066,984,421'Encapsulation for an electrical component and method for producing the same'20066,931,699'Method of producing a surface wave component with a drain for pyroelectric voltage'20056,528,924'Electronic component, in particular a component operating with surface acoustic waves'20036,449,828'Method of producing a surface acoustic wave component'20026,446,316'Method for producing an encapsulation for a SAW component operating with surface acoustic waves'20026,310,420'Electronic component in particular an saw component operating with surface acoustic waves and a method for its production'20016,242,842'Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production'20016,136,175'Method of producing an electronic component, in particular a surface acoustic wave component'20006,057,222'Method for the production of flip-chip mounting-ready contacts of electrical components'20005,900,286'Method of producing an attenuating structure on a surface wave component'19995,831,369'Encapsulation for electronic components and method for producing the encapsulation'19984,803,448'Cantilever mount of a substrate lamina of a surface wave device'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–2021Based in Munich, DE· patent location history
2002–2003Based in Mnchen, DE· patent location history
2005–2020Patents assigned to EPCOS AG (33)· patent assignee history
2006–2019Based in München, DE· patent location history
2012–2017Patents assigned to PAHL WOLFGANG (22)· patent assignee history
2012–2015Patents assigned to LEIDL ANTON (11)· patent assignee history
2012–2017Patents assigned to KRUEGER HANS (8)· patent assignee history
2017–2021Patents assigned to TDK CORP (10)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EPCOS AG332005–2020
PAHL WOLFGANGself222012–2017
LEIDL ANTON112012–2015
TDK CORP102017–2021
KRUEGER HANS82012–2017
Locations
LocationPatentsSpan
Munich, DE401989–2021
München, DE112006–2019
Mnchen, DE32002–2003