Inventor

SUNG-FENG YEH

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 108 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices34%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%

H10DInorganic electric semiconductor devices4%

H10BElectronic memory devices1%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%

H05KPrinted circuits0%

PatentTitleYear

12,564,108Package structure and method of fabricating the same2026 12,557,698Package and manufacturing method thereof2026 12,538,814Semiconductor structure with a bridge embedded therein and method manufacturing the same2026 12,500,192Package and manufacturing method thereof2025 12,489,077Semiconductor structure and method manufacturing the same2025 12,477,847Method of manufacturing semiconductor devices with system on chip devices2025 12,463,133Semiconductor structure and manufacturing method thereof2025 12,406,965Package2025 12,362,291Semiconductor device and method2025 12,355,008Methods of fabricating package structure2025 12,334,459Integrated circuits2025 12,327,815Integrated circuit package and method of forming the same2025 12,322,6733DIC with heat dissipation structure and warpage control2025 12,315,842Package structure2025 12,308,323Package-on-package device2025 12,293,985Integrated circuit packages and methods of forming the same2025 12,288,752Semiconductor packages2025 12,283,570Package structure2025 12,272,674Stacking structure, package structure and method of fabricating the same2025 12,272,622Package and manufacturing method thereof2025 12,266,584Integrated circuit package and method2025 12,266,637Die stack structure and manufacturing method thereof2025 12,255,116Semiconductor structure and manufacturing method thereof2025 12,224,265Three-dimensional stacking structure and manufacturing method thereof2025 12,218,026Package structure for heat dissipation2025 12,211,823Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same2025 12,205,911Bonding structure and method of forming same2025 12,199,024Semiconductor device and method of manufacture2025 12,170,264Integrated circuit packages and methods of forming the same2024 12,166,014Manufacturing method of package2024 12,154,897Package structures2024 12,136,619Methods of manufacturing three-dimensional integrated circuit structures2024 12,125,769Package structure and method of fabricating the same2024 12,125,820Through-dielectric vias for direct connection and method forming same2024 12,125,819Die on die bonding structure2024 12,125,821Package having multiple chips integrated therein and manufacturing method thereof2024 12,119,328Methods of fabricating the same die stack structure and semiconductor structure2024 12,094,852Package structure and method of manufacturing the same2024 12,074,131Package structure and manufacturing method thereof2024 12,074,140System formed through package-in-package formation2024 12,057,437Package structure, chip structure and method of fabricating the same2024 12,057,439Integrated circuit packages2024 12,057,438Die stack structure and manufacturing method thereof2024 12,051,673Package having multiple chips integrated therein and manufacturing method thereof2024 12,046,579Package having bonding layers2024 12,020,997Methods of forming semiconductor device packages having alignment marks on a carrier substrate2024 12,015,013Die stack structure, semiconductor structure and method of fabricating the same2024 12,002,778Semiconductor packages and methods of forming the same2024 11,978,716Package2024 11,967,553Semiconductor package and manufacturing method of the same2024 11,955,433Package-on-package device2024 11,916,012Manufacturing method of semiconductor structure2024 11,916,031Semiconductor device and method of manufacturing2024 11,894,309System on integrated chips (SoIC) and semiconductor structures with integrated SoIC2024 11,855,042Method of manufacturing semiconductor structure2023 11,854,921Integrated circuit package and method2023 11,854,785Package structure for heat dissipation2023 11,856,800Semiconductor devices with system on chip devices2023 11,848,246Integrated circuit package and method2023 11,837,578Package structure2023 11,810,897Package structure and method of fabricating the same2023 11,810,8993DIC formation with dies bonded to formed RDLs2023 11,784,163Stacking structure, package structure and method of fabricating the same2023 11,756,933Inactive structure on SoIC2023 11,756,907Bonding structure and method of forming same2023 11,742,297Semiconductor packages2023 11,735,544Semiconductor packages with stacked dies and methods of forming the same2023 11,728,275Semiconductor package and manufacturing method thereof2023 11,721,663Multi-level stacking of wafers and chips2023 11,721,598Method of forming semiconductor device package having testing pads on an upper die2023 11,715,723Wafer on wafer bonding structure2023 11,705,423Package structure2023 11,699,638Package and manufacturing method thereof2023 11,676,942Semiconductor structure and method of manufacturing the same2023 11,664,349Stacked chip package and methods of manufacture thereof2023 11,658,150System on integrated chips and methods of forming same2023 11,562,983Package having multiple chips integrated therein and manufacturing method thereof2023 11,562,982Integrated circuit packages and methods of forming the same2023 11,552,074Package structures and methods of fabricating the same2023 11,527,465Packages with Si-substrate-free interposer and method forming same2022 11,502,062Integrated circuit package and method2022 11,495,559Integrated circuits2022 11,476,201Package-on-package device2022 11,456,240Semiconductor device and method of manufacture2022 11,443,995Integrated circuit package and method2022 11,417,619Package and manufacturing method thereof2022 11,417,587Package structure and method of fabricating the same2022 11,417,629Three-dimensional stacking structure and manufacturing method thereof2022 11,387,209Package structure2022 11,380,653Die stack structure and manufacturing method thereof2022 11,373,981Package and manufacturing method thereof2022 11,362,064Semiconductor package with shared barrier layer in redistribution and via2022 11,362,013Package structure for heat dissipation2022 11,342,297Package structure and manufacturing method thereof2022 11,335,656Semiconductor device and method of manufacturing2022 11,322,477Package structure and method of fabricating the same2022 11,309,291Die stack structure and manufacturing method thereof2022 11,309,223Method of forming semiconductor device package having dummy devices on a first die2022 11,289,450Semiconductor structure and manufacturing method thereof2022 11,282,784Semiconductor package and manufacturing method of the same2022 11,264,343Bond pad structure for semiconductor device and method of forming same2022 11,264,362Semiconductor structure and method of fabricating the same2022 11,257,787Package structure and method of fabricating the same2022 11,239,225Three-dimensional integrated circuit structures and methods of manufacturing the same2022 11,233,035Package structure and method of manufacturing the same2022 11,227,812Package and manufacturing method thereof2022 11,189,599System formed through package-in-package formation2021 11,164,848Semiconductor structure and method manufacturing the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (108)· patent assignee history

2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	108	2021–2026

Locations

Location	Patents	Span
TW	108	2021–2026