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Inventor

Manabu Oie

Inventor
Watervliet, NY, US

Overview

2→
Patents
2017–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
C23CCoating metallic material14%
PatentTitleYear
10,157,784Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization20189,607,888'Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to TOKYO ELECTRON LTD (2)· patent assignee history
2017Based in Albany, NY, US· patent location history
2018Based in Watervliet, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO ELECTRON LTD22017–2018
Locations
LocationPatentsSpan
Watervliet, New York, US12018
Albany, New York, US12017