Inventor
Chiang-Jui Chu
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01FMagnets7%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
12,581,935Stacked via structures and methods for forming the same202612,431,452Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads202512,272,664Semiconductor packages having conductive pillars with inclined surfaces202511,901,323Semiconductor packages having conductive pillars with inclined surfaces202411,398,444Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same202211,282,785Wireless charging package with chip integrated in coil center2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2022–2026 |