Inventor
Hyo-geun Chae
Inventor
Seoul, KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01RElectrically-conductive connections8%
H05KPrinted circuits8%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
7,017,428'Test kit for semiconductor package and method for testing semiconductor package using the same'20066,841,425'Wafer treatment method for protecting fuse box of semiconductor chip'20056,489,790'Socket including pressure conductive rubber and mesh for testing of ball grid array package'20026,462,534'Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith'20026,450,839'Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device'20026,396,294'Socket pin and socket for electrical testing of semiconductor packages'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2006Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2002Based in Chungcheongnam-do, KR· patent location history
2002Based in Ahsan, KR· patent location history
2002Based in Asan-si, KR· patent location history
2005–2006Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2002–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 2 | 2005–2006 |
| Chungcheongnam-do, KR | 2 | 2002 |
| Ahsan, KR | 1 | 2002 |
| Asan-si, KR | 1 | 2002 |