Inventor
KATSUHIDE WATANABE
Inventor
JP
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing38%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H01LSemiconductor devices14%
G01BMeasuring length, thickness or similar linear dimensions10%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
H01FMagnets3%
PatentTitleYear
12,569,956Control method for processing of a substrate202612,179,310Output signal processing apparatus for eddy current sensor202412,076,834Eddy current sensor202412,062,563Substrate processing apparatus, substrate processing system, and substrate processing method202412,036,634Substrate processing control system, substrate processing control method, and program202412,017,323Polishing head system and polishing apparatus202411,833,636Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate202311,759,912Magnetic element and eddy current sensor using the same202311,673,222Polishing head system and polishing apparatus202311,465,254Polishing machine and a polishing method for a substrate202211,450,544Substrate processing apparatus, substrate processing system, and substrate processing method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to EBARA CORP (10)· patent assignee history
2022–2026Based in JP· patent location history
2026Patents assigned to KIOXIA CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 10 | 2022–2024 |
| KIOXIA CORP | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 11 | 2022–2026 |