Inventor
Jae Kul Lee
Inventor
Seoul, KR
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits16%
H01LSemiconductor devices15%
Y10TTechnical subjects covered by former us classification9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
H10KOrganic electric solid-state devices4%
A61BDiagnosis3%
A61NElectrotherapy3%
G06TImage data processing or generation, in general3%
G09GArrangements or circuits for control of indicating devices using static means to present variable information3%
PatentTitleYear
11,103,310Laser irradiation apparatus and method using robot arm202111,065,469Region division method for laser treatment, and laser treatment method and apparatus using the same202111,025,845Method, apparatus, and recording medium for processing image202110,985,227Organic light emitting diode display device202110,896,943Display device202110,847,476Semiconductor package202010,748,828Fan-out sensor package202010,741,498Semiconductor package202010,692,791Electronic component package with electromagnetic wave shielding202010,629,641Fan-out sensor package and optical-type fingerprint sensor module including the same202010,615,212Fan-out sensor package202010,438,927Fan-out semiconductor package20199,907,182'Method of manufacturing insulation film and printed circuit board'20189,035,196'Circuit board and method of manufacturing the same'20158,929,091'Method of manufacturing a printed circuit board (PCB)'20158,633,397'Method of processing cavity of core substrate'20148,284,562'Electro device embedded printed circuit board and manufacturing method thereof'20128,184,448'Bare chip embedded PCB'20128,011,086'Method of manufacturing a component-embedded printed circuit board'20117,947,906'Printed circuit board and manufacturing method thereof'20117,812,465'Semiconductor chip having alignment mark and method of manufacturing the same'20107,394,249'Printed circuit board with weak magnetic field sensor'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2020Patents assigned to SAMSUNG ELECTRO MECH (12)· patent assignee history
2008–2021Based in Seoul, KR· patent location history
2012–2015Patents assigned to LEE DOO-HWAN (4)· patent assignee history
2012–2015Patents assigned to LEE JAE-KUL (4)· patent assignee history
2012–2015Patents assigned to HAN KYUNG-JIN (2)· patent assignee history
2015–2020Based in Suwon-si, KR· patent location history
2018Based in Sejong-si, KR· patent location history
2019–2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2020–2021Based in Yongin-si, KR· patent location history
2021Based in Daejeon, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRO MECH | 12 | 2008–2020 |
| SAMSUNG ELECTRONICS CO LTD | 6 | 2019–2021 |
| LEE DOO-HWAN | 4 | 2012–2015 |
| LEE JAE-KULself | 4 | 2012–2015 |
| HAN KYUNG-JIN | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 10 | 2008–2021 |
| Suwon-si, KR | 7 | 2015–2020 |
| Daejeon, KR | 2 | 2021 |
| Yongin-si, KR | 2 | 2020–2021 |
| Sejong-si, KR | 1 | 2018 |