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Inventor

Da Y. Wang

Inventor
Taipei, TW

Overview

3→
Patents
1994–2009
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics14%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%
C23CCoating metallic material14%
H01JElectric discharge tubes or discharge lamps14%
H05BElectric heating14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
PatentTitleYear
7,523,914'High-hardness and corrosion-tolerant integrated circuit packing mold'20096,331,332'Process for depositing diamond-like carbon films by cathodic arc evaporation'20015,319,285'Starting circuit for a high intensity discharge lamp'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to GTE PROD CORP (1)· patent assignee history
1994Based in Lexington, MA, US· patent location history
2001Based in Taichung, TW· patent location history
2009Patents assigned to CHANG YIN YU (1)· patent assignee history
2009Patents assigned to LIU SHIEN CHEN (1)· patent assignee history
2009Patents assigned to WANG DA YUNG (1)· patent assignee history
2009Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANG YIN YU12009
GTE PROD CORP11994
LIU SHIEN CHEN12009
WANG DA YUNGself12009
Locations
LocationPatentsSpan
Taipei, TW12009
Taichung, TW12001
Lexington, Massachusetts, US11994