Inventor
EVELYN NAPETSCHNIG
Inventor
AT
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
C22CAlloys7%
H10DInorganic electric semiconductor devices7%
B23KSoldering or unsoldering3%
C23CCoating metallic material3%
PatentTitleYear
12,183,696Semiconductor device including bonding pad metal layer structure202412,040,288Chip package and method of forming a chip package202411,776,927Semiconductor device including a solder compound containing a compound Sn/Sb202311,764,176Semiconductor device including bonding pad metal layer structure202311,735,534Chip package and method of forming a chip package202311,615,963Electronic device, electronic module and methods for fabricating the same202311,501,979Semiconductor device and method of producing a semiconductor device202211,424,201Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device202211,410,950Semiconductor substrate having a bond pad material based on aluminum202211,367,654Component and method of manufacturing a component using an ultrathin carrier2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INFINEON TECHNOLOGIES AG (9)· patent assignee history
2022Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (1)· patent assignee history
2022–2024Based in AT· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 9 | 2022–2024 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| AT | 10 | 2022–2024 |