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Inventor

Yi-Hsiu Tseng

Inventor
Kaohsiung, TW

Overview

4→
Patents
2003–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices33%
G06FElectric digital data processing17%
PatentTitleYear
9,984,993Bonding structure for semiconductor package and method of manufacturing the same20189,496,238'Sloped bonding structure for semiconductor package'20168,375,200'Embedded device and file change notification method of the embedded device'20136,653,235'Fabricating process for forming multi-layered metal bumps by electroless plating'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003Patents assigned to IND TECH RES INST (1)· patent assignee history
2003Based in Taichung, TW· patent location history
2013Patents assigned to CHEN CHIEN-HUA (1)· patent assignee history
2013Patents assigned to HON HAI PREC IND CO LTD (1)· patent assignee history
2013Based in Taipei, TW· patent location history
2016–2018Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2016–2018Based in Kaohsiung, TW· patent location history
2018Patents assigned to ADVANCED SEMICONDUCTOR INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG22016–2018
ADVANCED SEMICONDUCTOR INC12018
CHEN CHIEN-HUA12013
HON HAI PREC IND CO LTD12013
IND TECH RES INST12003
Locations
LocationPatentsSpan
Kaohsiung, TW22016–2018
Taipei, TW12013
Taichung, TW12003