Inventor
Ravindranath Vithal MAHAJAN
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01LSemiconductor devices25%
G02BOptical elements, systems or apparatus20%
H10DInorganic electric semiconductor devices10%
H03FAmplifiers5%
H04BTransmission5%
H10BElectronic memory devices5%
PatentTitleYear
12,525,563Microelectronic assemblies including stacked dies coupled by a through dielectric via202612,506,127Package architecture of photonic system with vertically stacked dies having planarized edges202512,506,128Package architecture of scalable compute wall having compute bricks with vertically stacked dies202512,392,970Photonic integrated circuit packaging architectures202512,181,710Photonic integrated circuit packaging architecture202412,148,742Active bridge enabled co-packaged photonic transceiver202411,417,630Semiconductor package having passive support wafer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (7)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2026 |