Inventor
Yidnekachew S. MEKONNEN
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H05KPrinted circuits17%
H01PWaveguides11%
G11CStatic stores6%
H01RElectrically-conductive connections6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
12,519,062Multiple die package using an embedded bridge connecting dies202612,073,906Package pin pattern for device-to-device connection202411,791,528Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line202311,742,293Multiple die package using an embedded bridge connecting dies202311,545,416Minimization of insertion loss variation in through-silicon vias (TSVs)202311,437,366Tunable passive semiconductor elements202211,329,358Low loss and low cross talk transmission lines having l-shaped cross sections202211,322,445EMIB copper layer for signal and power routing2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (8)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2022–2026 |