Inventor
ARUN RAMAKRISHNAN
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
G02BOptical elements, systems or apparatus7%
G06KGraphical data reading7%
G06TImage data processing or generation, in general7%
G06VImage or video recognition or understanding7%
H01PWaveguides7%
H01QAntennas, i.e. radio aerials7%
H05KPrinted circuits7%
PatentTitleYear
12,593,726Semiconductor package with side wall interconnection202612,525,495Mixed dielectric materials for improving signal integrity of integrated electronics packages202612,463,319Integrated antennas on side wall of 3D stacked die202512,191,243Cantilevered power planes to provide a return current path for high-speed signals202511,906,802Photonics integration in semiconductor packages202411,222,432Object of interest tracking2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to IBM (1)· patent assignee history
2022Based in IN· patent location history
2024–2026Patents assigned to AVAGO TECH INT SALES PTE LID (5)· patent assignee history
2024–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AVAGO TECH INT SALES PTE LID | 5 | 2024–2026 |
| IBM | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2024–2026 |
| IN | 1 | 2022 |