Inventor
BETTY HILL-SHAN YEUNG
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H05KPrinted circuits23%
H01QAntennas, i.e. radio aerials15%
PatentTitleYear
12,406,896Semiconductor device package having thermal dissipation feature and method therefor202511,935,809Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements202411,817,366Semiconductor device package having thermal dissipation feature and method therefor202311,557,525Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to NXP USA INC (4)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP USA INC | 4 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2023–2025 |