Inventor
NAOHIRO HOSODA
Inventor
JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices31%
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
G11CStatic stores10%
H10DInorganic electric semiconductor devices10%
PatentTitleYear
12,550,328Three-dimensional memory device including a mid-stack source layer and methods for forming the same202612,476,192Three-dimensional memory device including a drain contact etch-stop dielectric layer and methods for forming the same202512,456,521Sub-block separation in NAND memory through word line based selectors202512,437,817Sub-block separation in NAND memory through word line based selectors202512,387,789X-direction divided sub-block mode in NAND202512,354,944Three-dimensional memory device containing plural metal oxide blocking dielectric layers and method of making thereof202511,894,298Three-dimensional memory device containing amorphous and crystalline blocking dielectric layers202411,417,621Memory die with source side of three-dimensional memory array bonded to logic die and methods of making the same202211,367,733Memory die with source side of three-dimensional memory array bonded to logic die and methods of making the same202211,289,416Three-dimensional memory device containing amorphous and crystalline blocking dielectric layers2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SANDISK TECHNOLOGIES LLC (7)· patent assignee history
2022–2026Based in JP· patent location history
2025–2026Patents assigned to SANDISK TECHNOLOGIES INC (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK TECHNOLOGIES LLC | 7 | 2022–2026 |
| SANDISK TECHNOLOGIES INC | 6 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 10 | 2022–2026 |