Inventor
HIROYUKI MATSUYAMA
Inventor
JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form28%
H05KPrinted circuits28%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds17%
C08JWorking-up6%
C08LCompositions of macromolecular compounds6%
C23CCoating metallic material6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
Y10TTechnical subjects covered by former us classification6%
PatentTitleYear
12,351,684Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board202511,976,171Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board202411,946,143Laminate202411,760,838Polyimide resin precursor202311,376,826Multi-layer film and metal laminate2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to ARISAWA SEISAKUSHO KK (5)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ARISAWA SEISAKUSHO KK | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2022–2025 |