Inventor
AKIHIRO HORIBE
Inventor
JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy8%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
A61BDiagnosis3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
G06NComputing arrangements based on specific computational models3%
H01JElectric discharge tubes or discharge lamps3%
PatentTitleYear
12,532,670Vertical transmon structure and its fabrication process202612,519,061Multichip interconnect package fine jet underfill202612,456,656Multichip interconnect package202512,315,775Underfill vacuum process202512,142,603Bonding of bridge to multiple semiconductor chips202412,094,825Interconnection between chips by bridge chip202412,087,596Controlling of height of high-density interconnection structure on substrate202411,908,723Silicon handler with laser-release layers202411,848,272Interconnection between chips by bridge chip202311,735,575Bonding of bridge to multiple semiconductor chips202311,637,325Large capacity solid state battery202311,574,848Underfill injection for electronic devices202311,320,419Sampling of breath gas202211,316,143Stacked device structure202211,211,638Large capacity solid state battery2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (15)· patent assignee history
2021–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 15 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 15 | 2021–2026 |