Inventor
Runzi Chang
Inventor
San Jose, CA, US
Overview
Patents· 50 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10BElectronic memory devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H10DInorganic electric semiconductor devices12%
H10NElectric solid-state devices not otherwise provided for11%
G11CStatic stores10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G06FElectric digital data processing3%
Y02PClimate change mitigation technologies in the production or processing of goods2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,854,455Methods and apparatus for fabricating IC chips with tilted patterning202010,784,167Isolation components for transistors formed on fin features of semiconductor substrates202010,784,250Sub-device field-effect transistor architecture for integrated circuits202010,713,411Photolithography mask design-rule check assistance202010,707,411MRAM structure for efficient manufacturability202010,672,861Memory chip design for manufacturing202010,600,793Fabricating memory devices with optimized gate oxide thickness202010,535,774Modular memory-like layout for finFET analog designs202010,522,394Method of creating aligned vias in ultra-high density integrated circuits201910,431,574Methods and systems for packaging semiconductor devices to improve yield201910,319,727Fabricating memory devices with optimized gate oxide thickness201910,217,669Isolation components for transistors formed on fin features of semiconductor substrates201910,056,363Methods and systems to improve yield in multiple chips integration processes201810,037,400Integrated circuit manufacturing process for aligning threshold voltages of transistors20189,768,144'Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate'20179,490,427'Resistive random access memory cell structure'20169,397,218'Method and apparatus for mitigating effects of parasitic capacitance in semiconductor devices'20169,391,045'Recessed semiconductor substrates and associated techniques'20169,275,985'RC networks that include an integrated high resistance resistor on top of a MOS capacitor'20169,275,731'Systems and methods for increasing the read sensitivity of a resistive random access memory (RRAM)'20169,257,410'Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate'20169,245,961'Reducing source contact to gate spacing to decrease transistor pitch'20169,214,230'Resistive random access memory cell structure with reduced programming voltage'20159,147,837'Resistive memory cell and method for forming a resistive memory cell'20159,142,445'Method and apparatus for forming shallow trench isolation structures having rounded corners'20159,129,678'Method and apparatus for reforming a memory cell of a memory'20159,112,133'Resistive random access memory and method for controlling manufacturing of corresponding sub-resolution features of conductive and resistive elements'20159,047,945'Systems and methods for reading resistive random access memory (RRAM) cells'20159,042,159'Configuring resistive random access memory (RRAM) array for write operations'20159,034,730'Recessed semiconductor substrates and associated techniques'20158,999,786'Reducing source contact to gate spacing to decrease transistor pitch'20158,993,398'Method for creating ultra-high-density holes and metallization'20158,947,909'System and method for creating a bipolar resistive RAM (RRAM)'20158,934,285'Method and apparatus for forming a contact in a cell of a resistive random access memory to reduce a voltage required to program the cell'20158,885,388'Apparatus and method for reforming resistive memory cells'20148,873,309'Apparatus and method for repairing resistive memories and increasing overall read sensitivity of sense amplifiers'20148,609,528'High-density patterning'20138,241,993'Method for shallow trench isolation'20128,030,215'Method for creating ultra-high-density holes and metallization'20118,030,128'Method to form high density phase change memory (PCM) top contact every two bits'20117,994,052'High-density patterning'20117,985,616'Methods to form wide heater trenches and to form memory cells to engage heaters'20117,939,414'Ion implantation and process sequence to form smaller base pick-up'20117,939,445'High density via and metal interconnect structures, and methods of forming the same'20117,892,936'Self aligned integration of high density phase change memory with thin film access device'20117,888,166'Method to form high efficiency GST cell using a double heater cut'20117,863,709'Low base resistance bipolar junction transistor array'20117,807,539'Ion implantation and process sequence to form smaller base pick-up'20107,745,809'Ultra high density phase change memory having improved emitter contacts, improved GST cell reliability and highly matched UHD GST cells using column mirco-trench strips'20107,709,835'Method to form high efficiency GST cell using a double heater cut'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2020Patents assigned to MARVELL WORLD TRADE LTD (28)· patent assignee history
2010–2020Patents assigned to MARVELL INT LTD (22)· patent assignee history
2010–2020Based in San Jose, CA, US· patent location history
2010–2015Based in Santa Clara, CA, US· patent location history
2012–2016Patents assigned to CHANG RUNZI (7)· patent assignee history
2012–2016Patents assigned to WU ALBERT (5)· patent assignee history
2020Patents assigned to MARVELL ASIA PTE LTD (4)· patent assignee history
2020Based in Saratoga, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MARVELL WORLD TRADE LTD | 28 | 2010–2020 |
| MARVELL INT LTD | 22 | 2010–2020 |
| CHANG RUNZIself | 7 | 2012–2016 |
| WU ALBERT | 5 | 2012–2016 |
| MARVELL ASIA PTE LTD | 4 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 45 | 2010–2020 |
| Santa Clara, California, US | 4 | 2010–2015 |
| Saratoga, California, US | 1 | 2020 |