Inventor
WEI-JHIH MAO
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices27%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems27%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock12%
H01LSemiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G01CMeasuring distances, levels or bearings4%
G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves4%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
PatentTitleYear
12,497,285Stopper bump structures for MEMS device202512,412,863Die attached leveling control by metal stopper bumps202512,358,783Wire-bond damper for shock absorption202512,322,722Die attached leveling control by metal stopper bumps202511,993,510Composite spring structure to reinforce mechanical robustness of a MEMS device202411,987,494Wire-bond damper for shock absorption202411,923,331Die attached leveling control by metal stopper bumps202411,661,333Semiconductor structure and manufacturing method thereof202311,420,866Composite spring structure to reinforce mechanical robustness of a MEMS device202211,235,969CMOS-MEMS integration with through-chip via process2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2022–2025 |