Inventor
Yoshihiro Nomura
Inventor
Ichihara, JP
Overview
Patents· 47 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y02TClimate change mitigation technologies related to transportation8%
Y10TTechnical subjects covered by former us classification6%
B60LPropulsion of electrically-propelled vehicles4%
B62KCycles4%
C09JAdhesives4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
F02DControlling combustion engines4%
C08LCompositions of macromolecular compounds3%
F02BInternal-combustion piston engines3%
PatentTitleYear
10,619,617Ignition device for internal combustion engine202010,406,933Vehicle201910,361,576Automobile and control method for automobile201910,279,857Vehicle driving force control device201910,229,878Semiconductor device201910,017,058Automobile20189,937,817Vehicle having charging time estimation based upon actuation patterns20189,933,281Position detection apparatus20189,862,246'Air conditioning control device of vehicle'20189,752,862'Accelerator opening degree detection device'20179,683,480'Spark ignition type internal combustion engine'20179,448,054'Throttle opening detection device'20169,086,719'Throttle control apparatus for a saddle-type vehicle, and vehicle including same'20159,051,886'Hybrid vehicle'20159,013,138'Charging apparatus for electric storage device, vehicle equipped with the charging apparatus, and method of controlling the charging apparatus'20158,970,356'Vehicle approach notification apparatus for electric motorcycle'20158,854,196'Vehicle approach notification apparatus for electric motorcycle'20148,765,867'Heat-resistant resin paste and method for producing same'20148,740,422'Bulb and luminaire'20147,560,307'Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same'20097,449,076'Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame'20087,273,654'Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame'20077,097,869'Nutraceutical chips and production method thereof'20067,061,081'Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof'20066,621,170'Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film'20036,558,500'Method of producing a lead frame with composite film attached, and use of the lead frame'20036,523,446'Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame'20036,516,201'Mobile radio communication apparatus having a plurality of MINs'20036,462,148'Adhesive film of quinoline polymer and bismaleimide'20026,449,499'Dual-mode radio connected to an apparatus for communicating through in analog mode'20026,445,076'Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same'20026,408,020'Dual-mode radio communication device having function for selectively using analog or digital mode'20026,334,426'Direct fuel injection-type spark-ignition internal combustion engine'20026,302,991'Method of producing a lead frame with composite film attached, and use of the lead frame'20016,265,782'Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film'20016,263,855'Direct fuel injection-type spark-ignition internal combustion engine'20016,257,199'Direct fuel injection-type spark-ignition internal combustion engine'20016,154,639'Handsfree unit'20005,998,020'Composite film and lead frame with composite film attached'19995,680,818'Apparatus and system for removing dust from printing plate of printing press'19975,212,279'Hot-melt adhesive and its use in polyimide film and printed circuit board'19935,180,786'Impact modifier, thermoplastic resin composition using the same and molded article obtained therefrom'19934,954,612'Solvent-soluble polyimide and production thereof'19904,950,573'Toner for developing latent electrostatic images'19904,927,353'Catalytic combustion device'19904,888,263'Color toner for electrophotography'19894,762,763'Toner for developing electrostatic latent image'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2014Patents assigned to HITACHI CHEMICAL CO LTD (16)· patent assignee history
1990–2009Based in Ichihara, JP· patent location history
1990–2002Based in Aichi, JP· patent location history
2000–2003Patents assigned to TOSHIBA KK (4)· patent assignee history
2000–2019Based in Tokyo, JP· patent location history
2001–2019Patents assigned to TOYOTA MOTOR CO LTD (10)· patent assignee history
2014–2019Patents assigned to HONDA MOTOR CO LTD (7)· patent assignee history
2014–2017Patents assigned to NOMURA YOSHIHIRO (7)· patent assignee history
2014–2016Based in Saitama, JP· patent location history
2015–2019Based in Toyota, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 16 | 1990–2014 |
| TOYOTA MOTOR CO LTD | 10 | 2001–2019 |
| HONDA MOTOR CO LTD | 7 | 2014–2019 |
| NOMURA YOSHIHIROself | 7 | 2014–2017 |
| TOSHIBA KK | 4 | 2000–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ichihara, JP | 15 | 1990–2009 |
| Toyota, JP | 7 | 2015–2019 |
| Tokyo, JP | 5 | 2000–2019 |
| Saitama, JP | 4 | 2014–2016 |
| Aichi, JP | 4 | 1990–2002 |