Inventor
YA-LIEN LEE
Inventor
TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
C23CCoating metallic material5%
H10DInorganic electric semiconductor devices5%
H01JElectric discharge tubes or discharge lamps3%
PatentTitleYear
12,581,925Selective metal cap in an interconnect structure202612,368,103Diffusion barrier layer for conductive via to decrease contact resistance202512,354,958Semiconductor devices and methods of formation202512,315,809Via for semiconductor device and method202512,068,194Selective deposition of metal barrier in damascene processes202411,961,761Mitigating pattern collapse202411,908,697Interconnect structure having a carbon-containing barrier layer202411,851,749Semiconductor device, method and machine of manufacture202311,837,500Selective deposition of metal barrier in damascene processes and the structures formed thereof202311,810,857Via for semiconductor device and method202311,742,291Diffusion barrier layer for conductive via to decrease contact resistance202311,676,898Diffusion barrier for semiconductor device and method202311,527,476Interconnect structure of semiconductor device202211,527,411Interconnect structure having a carbon-containing barrier layer202211,398,406Selective deposition of metal barrier in damascene processes202211,362,035Diffusion barrier layer for conductive via to decrease contact resistance202211,345,991Semiconductor device, method and machine of manufacture202211,183,424Barrier layer formation for conductive feature202111,177,168Device and method for reducing contact resistance of a metal202111,145,542Global dielectric and barrier layer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (20)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 20 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 20 | 2021–2026 |