Inventor
Cliff C. Lee
Inventor
Portland, OR, US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices17%
H10DInorganic electric semiconductor devices17%
PatentTitleYear
9,961,769Microelectronic substrate for alternate package functionality20188,674,235'Microelectronic substrate for alternate package functionality'20147,356,796'Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2018Patents assigned to INTEL CORP (3)· patent assignee history
2008–2018Based in Portland, OR, US· patent location history
2014Patents assigned to BROWNING DAVID W (1)· patent assignee history
2014Patents assigned to HOSSAIN MD ALTAF (1)· patent assignee history
2014Patents assigned to KELLY BRIAN P (1)· patent assignee history
2014Patents assigned to LEE CLIFF C (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 3 | 2008–2018 |
| BROWNING DAVID W | 1 | 2014 |
| HOSSAIN MD ALTAF | 1 | 2014 |
| KELLY BRIAN P | 1 | 2014 |
| LEE CLIFF Cself | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Portland, OR, US | 3 | 2008–2018 |