Inventor
Vladimir Odnoblyudov
Inventor
Danville, CA, US
Overview
Patents· 156 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10HInorganic light-emitting semiconductor devices having potential barriers17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H10DInorganic electric semiconductor devices8%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted4%
H05BElectric heating4%
F21VFunctional features or details of lighting devices or systems thereof3%
C30BSingle-crystal growth3%
F21KNon-electric light sources using luminescence3%
PatentTitleYear
11,121,244RF device integrated on an engineered substrate202111,121,120Method and system for electronic devices with polycrystalline substrate structure interposer202111,107,720Methods of manufacturing vertical semiconductor diodes using an engineered substrate202111,092,297Linear LED module202111,094,860Wafer-level solid state transducer packaging transducers including separators and associated systems and methods202111,088,119High efficiency chip-on-board light-emitting diode202111,060,697Light-emitting device with reflective ceramic substrate202111,011,373Engineered substrate structures for power and RF applications202110,964,535Polycrystalline ceramic substrate and method of manufacture202110,937,776Solid state transducers with state detection, and associated systems and methods202110,930,576Gallium-nitride based devices implementing an engineered substrate structure202110,910,522High efficiency LEDs and LED lamps202110,910,258Engineered substrate structure and method of manufacture202110,903,403LED array package202110,896,995Solid state lighting devices with accessible electrodes and methods of manufacturing202110,892,384Etched trenches in bond materials for die singulation, and associated systems and methods202110,886,445Vertical solid-state transducers having backside terminals and associated systems and methods202110,886,444Solid state optoelectronic device with preformed metal support substrate202110,879,444Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods202010,879,428Solid-state transducer devices with selective wavelength reflectors and associated systems and methods202010,840,410Ultrathin solid state dies and methods of manufacturing the same202010,833,186Gallium nitride epitaxial structures for power devices202010,811,397Chip-on-board design with color mixing202010,763,109Methods of manufacturing engineered substrate structures for power and RF applications202010,763,110Method and system for forming doped regions by diffusion gallium nitride materials202010,763,299Wide band gap device integrated circuit architecture on engineered substrate202010,755,986Aluminum nitride based Silicon-on-Insulator substrate structure202010,734,486Lateral high electron mobility transistor with integrated clamp diode202010,734,303Power and RF devices implemented using an engineered substrate structure202010,711,957Linear LED module202010,679,852Multi-deposition process for high quality gallium nitride device manufacturing202010,663,142Light-emitting device with reflective ceramic substrate202010,655,243Growth of epitaxial gallium nitride material using a thermally matched substrate202010,622,468RF device integrated on an engineered substrate202010,615,221Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods202010,580,935Ultrathin solid state dies and methods of manufacturing the same202010,573,516Methods for integrated devices on an engineered substrate202010,566,190Polycrystalline ceramic substrate202010,559,719Solid-state radiation transducer devices having at least partially transparent buried-contact elements, and associated systems and methods202010,553,745Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods202010,553,760Solid state transducer dies having reflective features over contacts and associated systems and methods202010,535,547Methods of forming a vertical semiconductor diode using an engineered substrate202010,529,613Electronic power devices integrated with an engineered substrate202010,510,582Engineered substrate structure201910,510,577Lift off process for chip scale package solid state devices on engineered substrate201910,490,636Lateral high electron mobility transistor with integrated clamp diode201910,483,481Solid state optoelectronic device with plated support substrate201910,475,976Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods201910,468,562Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods201910,461,064Red flip chip light emitting diode, package, and method of making the same201910,438,792Methods for integration of elemental and compound semiconductors on a ceramic substrate201910,431,714Engineered substrates for semiconductor devices and associated systems and methods201910,418,509Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods201910,411,108Vertical gallium nitride Schottky diode201910,403,607Chip-on-board design with color mixing201910,397,996Inrush energy control for a light emitter201910,395,965Electronic power devices integrated with an engineered substrate201910,361,245Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods201910,355,120Gallium nitride epitaxial structures for power devices201910,347,614Solid state transducers with state detection, and associated systems and methods201910,347,609Solid-state transducer assemblies with remote converter material for improved light extraction efficiency and associated systems and methods201910,333,039Vertical solid-state transducers having backside terminals and associated systems and methods201910,326,043Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices201910,312,378Lateral gallium nitride JFET with controlled doping profile201910,297,445Engineered substrate structure for power and RF applications201910,297,731Light emitting diode constructions and methods for making the same201910,290,674Engineered substrate including light emitting diode and power circuitry201910,281,091High efficiency LEDs and LED lamps201910,256,367Ultrathin solid state dies and methods of manufacturing the same201910,256,369Solid state lighting devices with accessible electrodes and methods of manufacturing201910,249,806Solid state optoelectronic device with preformed metal support substrate201910,242,970Discontinuous patterned bonds for semiconductor devices and associated systems and methods201910,230,035Light emitting diode package having series connected LEDs201910,211,185High efficiency chip-on-board light-emitting diode201910,205,069LED array package201910,204,778Method and system for vertical power devices201910,181,419Vertical semiconductor diode manufactured with an engineered substrate201910,170,668Solid state lighting devices with improved current spreading and light extraction and associated methods201910,145,522Linear LED module201810,141,371Wide band gap device integrated circuit device201810,134,589Polycrystalline ceramic substrate and method of manufacture201810,134,969Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods201810,103,290Ultrathin solid state dies and methods of manufacturing the same201810,096,748Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods201810,074,567Method and system for vertical integration of elemental and compound semiconductors201810,066,792Serial and parallel LED configurations for linear lighting modules201810,020,432Etched trenches in bond materials for die singulation, and associated systems and methods201810,008,647Wafer-level solid state transducer packaging transducers including separators and associated systems and methods20189,997,391Lift off process for chip scale package solid state devices on engineered substrate20189,997,662Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods20189,985,183Solid state lighting devices with accessible electrodes and methods of manufacturing20189,985,170Flip chip light emitting diode having transparent material with surface features20189,978,724Red flip chip light emitting diode, package, and method of making the same20189,978,807Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods20189,966,414High efficiency LEDs and LED lamps20189,911,903'Solid state transducer dies having reflective features over contacts and associated systems and methods'20189,853,197Light emitting diode package having series connected LEDs20179,845,926Linear LED module20179,812,606'Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices'20179,791,112'Serial and parallel LED configurations for linear lighting modules'20179,768,366'Solid state optoelectronic device with preformed metal support substrate'20179,765,936'High efficiency LEDs and LED lamps'20179,768,271'Methods, devices, and systems related to forming semiconductor power devices with a handle substrate'20179,756,697'Monolithic LED chip in an integrated control module with active circuitry'20179,728,696'Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods'20179,705,038'Engineered substrate assemblies with epitaxial templates and related systems, methods, and devices'20179,653,654'Solid-state radiation transducer devices having at least partially transparent buried contact elements, and associated systems and methods'20179,653,647'Ultrathin solid state dies and methods of manufacturing the same'20179,634,187'Flip chip light emitting diode having trnsparent material with surface features'20179,601,675'Vertical solid-state transducers having backside terminals and associated systems and methods'20179,585,206'Multi-junction solid state transducer devices for direct AC power and associated systems and methods'20179,577,058'Devices, systems, and methods related to removing parasitic conduction in semiconductor devices'20179,559,150'High efficiency LEDs and LED lamps'20179,496,454'Solid state optoelectronic device with plated support substrate'20169,490,239'Solid state transducers with state detection, and associated systems and methods'20169,450,152'Solid state transducer dies having reflective features over contacts and associated systems and methods'20169,444,014'Solid state lighting devices with accessible electrodes and methods of manufacturing'20169,433,040'Light-emitting metal-oxide-semiconductor devices and associated systems, devices, and methods'20169,431,462'High efficiency LEDs and LED lamps'20169,419,182'Solid-state radiation transducer devices having at least partially transparent buried-contact elements, and associated systems and methods'20169,420,658'Inrush energy control for a light emitter'20169,392,666'Monolithic LED chip in an integrated control module with active circuitry'20169,373,661'Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods'20169,362,259'Discontinuous patterned bonds for semiconductor devices and associated systems and methods'20169,331,252'Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods'20169,326,338'Multi-junction solid state transducer devices for direct AC power and associated systems and methods'20169,324,905'Solid state optoelectronic device with preformed metal support substrate'20169,310,045'Linear LED module'20169,293,639'Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods'20169,277,618'Monolithic LED chip in an integrated control module with active circuitry'20169,269,858'Engineered substrates for semiconductor devices and associated systems and methods'20169,196,810'Vertical solid-state transducers having backside terminals and associated systems and methods'20159,179,510'High efficiency LEDs and LED lamps'20159,159,896'Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods'20159,105,701'Semiconductor devices having compact footprints'20159,082,692'Engineered substrate assemblies with epitaxial templates and related systems, methods, and devices'20159,082,748'Devices, systems, and methods related to removing parasitic conduction in semiconductor devices'20159,059,380'Discontinuous patterned bonds for semiconductor devices and associated systems and methods'20159,054,235'Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices'20159,000,456'Solid state lighting devices with accessible electrodes and methods of manufacturing'20158,975,614'Wavelength converters for solid state lighting devices, and associated systems and methods'20158,963,121'Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods'20158,952,395'Wafer-level solid state transducer packaging transducers including separators and associated systems and methods'20158,952,399'Light emitting device comprising a wavelength conversion layer having indirect bandgap energy and made of an N-type doped AlInGaP material'20158,952,413'Etched trenches in bond materials for die singulation, and associated systems and methods'20158,921,134'High efficiency LEDS and LED lamps'20148,912,554'Long wavelength light emitting device with photoluminescence emission and high quantum efficiency'20148,809,897'Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods'20148,754,424'Discontinuous patterned bonds for semiconductor devices and associated systems and methods'20148,616,728'Array solid state lighting device package'20138,598,611'Vertical solid-state transducers and solid-state transducer arrays having backside terminals and associated systems and methods'20138,536,594'Solid state lighting devices with reduced dimensions and methods of manufacturing'20138,497,146'Vertical solid-state transducers having backside terminals and associated systems and methods'20138,476,649'Solid state lighting devices with accessible electrodes and methods of manufacturing'20138,384,114'High efficiency LEDs and LED lamps'20138,338,849'High efficiency LEDS and LED lamps'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2021Patents assigned to ODNOBLYUDOV VLADIMIR (32)· patent assignee history
2012–2021Based in Eagle, ID, US· patent location history
2013–2021Patents assigned to MICRON TECHNOLOGY INC (80)· patent assignee history
2013–2020Patents assigned to SCHUBERT MARTIN F (15)· patent assignee history
2016–2021Patents assigned to BRIDGELUX INC (26)· patent assignee history
2016–2021Based in Danville, CA, US· patent location history
2017Based in Danivlle, CA, US· patent location history
2018–2021Patents assigned to QROMIS INC (38)· patent assignee history
2020Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 80 | 2013–2021 |
| QROMIS INC | 38 | 2018–2021 |
| ODNOBLYUDOV VLADIMIRself | 32 | 2012–2021 |
| BRIDGELUX INC | 26 | 2016–2021 |
| SCHUBERT MARTIN F | 15 | 2013–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Danville, California, US | 82 | 2016–2021 |
| Eagle, ID, US | 72 | 2012–2021 |
| Santa Clara, California, US | 1 | 2020 |
| Danivlle, California, US | 1 | 2017 |