Inventor
Daniel P. Labzentis
Inventor
Apalachin, NY, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
Y10TTechnical subjects covered by former us classification13%
PatentTitleYear
6,515,233'Method of producing flex circuit with selectively plated gold'20036,383,401'Method of producing flex circuit with selectively plated gold'20026,281,437'Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connection'20015,766,499'Method of making a circuitized substrate'19985,731,547'Circuitized substrate with material containment means and method of making same'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2001Patents assigned to IBM (3)· patent assignee history
1998Based in Endicott, NY, US· patent location history
2001–2003Based in Apalachin, NY, US· patent location history
2002Patents assigned to INTERNAT FLEX TECHNOLOGIES INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 3 | 1998–2001 |
| INTERNAT FLEX TECHNOLOGIES INC | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Apalachin, New York, US | 3 | 2001–2003 |
| Endicott, New York, US | 2 | 1998 |