Inventor

Yoshihiro Koshido

Inventor
Kanazawa, JP

Overview

22→
Patents
2000–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H03Hprimary
H03HImpedance networks, e.g. resonant circuits20%
Y10TTechnical subjects covered by former us classification15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H01GCapacitors7%
H05KPrinted circuits7%
H10DInorganic electric semiconductor devices6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
C23FNon-mechanical removal of metallic material from surface4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
PatentTitleYear
10,032,567Solid-state electrolytic capacitor manufacturing method and solid-state electrolytic capacitor20189,552,928'Solid-state electrolytic capacitor manufacturing method and solid-state electrolytic capacitor'20179,490,076'Solid electrolytic capacitor and manufacturing method therefor'20168,780,533'Solid electrolytic capacitor and method for producing the same'20148,256,275'In-liquid-substance detection sensor'20128,104,404'Ignition element mounting capacitor, header assembly, squib and gas generator for air bag and gas generator for seat belt pretensioner'20127,316,783'Method of wiring formation and method for manufacturing electronic components'20087,259,500'Piezoelectric device'20077,102,272'Piezoelectric component and method for manufacturing the same'20067,042,056'Chip-size package piezoelectric component'20066,826,815'Method for manufacturing a surface acoustic wave device'20046,821,712'Methods of forming resist pattern, forming electrode pattern, and manufacturing surface acoustic wave device'20046,808,641'Method of wiring formation and method for manufacturing electronic components'20046,762,533'Surface acoustic wave device'20046,725,513'Method for manufacturing surface acoustic wave apparatus'20046,686,675'Electronic device and method for producing the same'20046,581,258'Method of forming electrode film'20036,369,491'Surface acoustic wave device and method for manufacturing the same'20026,358,429'Electronic device and method for producing the same'20026,340,635'Resist pattern, process for the formation of the same, and process for the formation of wiring pattern'20026,204,190'Method for producing an electronic device'20016,156,672'Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2018Patents assigned to MURATA MANUFACTURING CO (21)· patent assignee history
2000–2006Based in Shiga, JP· patent location history
2002–2008Based in Kanazawa, JP· patent location history
2004–2012Based in Yasu, JP· patent location history
2004–2014Based in Kyoto, JP· patent location history
2012–2014Patents assigned to KOSHIDO YOSHIHIRO (3)· patent assignee history
2012Patents assigned to AIZAWA NAOKO (2)· patent assignee history
2012–2014Patents assigned to FUJIMOTO KOJI (2)· patent assignee history
2012Patents assigned to YAMADA HAJIME (2)· patent assignee history
2012–2018Based in Nagaokakyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MURATA MANUFACTURING CO212000–2018
KOSHIDO YOSHIHIROself32012–2014
AIZAWA NAOKO22012
FUJIMOTO KOJI22012–2014
YAMADA HAJIME22012
Locations
LocationPatentsSpan
Kanazawa, JP72002–2008
Shiga, JP62000–2006
Nagaokakyo, JP42012–2018
Yasu, JP32004–2012
Kyoto, JP22004–2014