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Inventor

Wei-Hong Lai

Inventor
Kaohsiung, TW

Overview

2→
Patents
2016–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
9,773,753'Semiconductor devices and methods of manufacturing the same'20179,478,500'Interposer substrate, semiconductor structure and fabricating process thereof'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016–2017Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2016–2017Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG22016–2017
Locations
LocationPatentsSpan
Kaohsiung, TW22016–2017