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Inventor

Meng-Hung Yeh

Inventor
Taichung, TW

Overview

2→
Patents
2016
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering33%
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
9,355,989'Wire bonding device and method of eliminating defective bonding wire'20169,289,846'Method for fabricating wire bonding structure'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (2)· patent assignee history
2016Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SILICONWARE PRECISION INDUSTRIES CO LTD22016
Locations
LocationPatentsSpan
Taichung, TW22016