Inventor
Takanori Kondo
Inventor
Sabae, JP
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Gprimary
H01GCapacitors38%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G01BMeasuring length, thickness or similar linear dimensions3%
H01LSemiconductor devices3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
A01KAnimal husbandry1%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables1%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients1%
C08LCompositions of macromolecular compounds1%
PatentTitleYear
9,823,065'Surface measurement apparatus'20179,366,625'Surface measurement device'20168,697,798'Silicone rubber composition for use as high-voltage insulator and polymer insulator'20147,215,531'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'20076,909,593'Multi-layer capacitor, wiring board, and high-frequency circuit'20056,771,484'Multi-layer capacitor, wiring board, and high-frequency circuit'20046,721,153'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'20046,678,145'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'20046,594,136'Multi-layer capacitor, wiring board, and high-frequency circuit'20036,556,420'Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board'20036,549,395'Multilayer capacitor'20036,496,354'Multilayer capacitor'20026,462,932'Multilayer Capacitor'20026,430,025'Multilayer capacitor'20026,407,904'Multi-layer capacitor'20026,370,010'Multi-layer capacitor, wiring board, and high-frequency circuit'20026,370,011'Multilayer capacitor'20026,351,369'Multi-layer capacitor, wiring substrate, decoupling circuit, and high-frequency circuit'20026,344,961'Multi-layer capacitator, wiring substrate, decoupling circuit, and high-frequency circuit'20026,331,930'Multilayer capacitor, electronic device and high frequency circuit using the same'20016,327,134'Multi-layer capacitor, wiring board, and high-frequency circuit'20016,292,350'Multilayer capacitor'20016,266,228'Multilayer capacitor'20016,266,229'Multilayer capacitor'20016,226,169'Multilayer capacitor'20016,215,647'Multilayer capacitor'20016,191,932'Monolithic capacitor'20016,188,565'Multilayer capacitor'20016,072,687'Multilayer capacitor'20006,038,121'Monolithic capacitor'20006,034,864'Multilayer capacitor'20005,423,494'Pet rope winder'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995Patents assigned to DAIDO STEEL CO LTD (1)· patent assignee history
1995Based in Urawa, JP· patent location history
2000–2007Patents assigned to MURATA MANUFACTURING CO (27)· patent assignee history
2000–2007Based in Sabae, JP· patent location history
2001Patents assigned to MURATA MANFACTURING CO LTD (1)· patent assignee history
2001Based in Yokohama, JP· patent location history
2014Patents assigned to NGK INSULATORS LTD (1)· patent assignee history
2014Based in Kasugai, JP· patent location history
2016–2017Patents assigned to HITACHI HIGH TECH CORP (2)· patent assignee history
2016–2017Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 27 | 2000–2007 |
| HITACHI HIGH TECH CORP | 2 | 2016–2017 |
| DAIDO STEEL CO LTD | 1 | 1995 |
| MURATA MANFACTURING CO LTD | 1 | 2001 |
| NGK INSULATORS LTD | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sabae, JP | 27 | 2000–2007 |
| Tokyo, JP | 2 | 2016–2017 |
| Kasugai, JP | 1 | 2014 |
| Yokohama, JP | 1 | 2001 |
| Urawa, JP | 1 | 1995 |