Inventor
Wen-Chou Tsai
Inventor
Taoyuan, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1045%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H01LSemiconductor devices9%
PatentTitleYear
10,971,4173D stacked-chip package20218,502,393'Chip package and method for forming the same'20138,294,275'Chip package and method for forming the same'20127,544,623'Method for fabricating a contact hole'20097,378,341'Automatic process control of after-etch-inspection critical dimension'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2013Based in Taoyuan, TW· patent location history
2012–2013Patents assigned to CHEN CHIH-HAO (2)· patent assignee history
2012–2013Patents assigned to CHIOU GUO-JYUN (2)· patent assignee history
2012–2013Patents assigned to FANG MING-HONG (2)· patent assignee history
2012–2013Patents assigned to FU SHENG-HSIANG (2)· patent assignee history
2012–2013Patents assigned to LIN CHAO-YEN (2)· patent assignee history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHEN CHIH-HAO | 2 | 2012–2013 |
| CHIOU GUO-JYUN | 2 | 2012–2013 |
| FANG MING-HONG | 2 | 2012–2013 |
| FU SHENG-HSIANG | 2 | 2012–2013 |
| LIN CHAO-YEN | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taoyuan, TW | 4 | 2008–2013 |
| Hsinchu, TW | 1 | 2021 |