Inventor
Casey Prindiville
Inventor
Nampa, ID, US
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
Y10TTechnical subjects covered by former us classification32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables6%
PatentTitleYear
7,163,845'Internal package heat dissipator'20076,949,824'Internal package heat dissipator'20056,891,108'Semiconductor packages and methods for making the same'20056,858,927'Semiconductor packages and methods for making the same'20056,833,510'Semiconductor packages and methods for making the same'20046,791,198'Method and apparatus for gate blocking X-outs during a molding process'20046,779,258'Semiconductor packages and methods for making the same'20046,776,599'Method and apparatus for gate blocking X-outs during a molding process'20046,749,711'Apparatus and methods for coverlay removal and adhesive application'20046,548,764'Semiconductor packages and methods for making the same'20036,543,510'Apparatus and methods for coverlay removal and adhesive application'20036,523,254'Method for gate blocking x-outs during a molding process'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2007Patents assigned to MICRON TECHNOLOGY INC (12)· patent assignee history
2003–2007Based in Nampa, ID, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 12 | 2003–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nampa, ID, US | 12 | 2003–2007 |