Inventor
Yajun Wei
Inventor
Cincinnati, OH, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10HInorganic light-emitting semiconductor devices having potential barriers18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation15%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution13%
H05BElectric heating2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications2%
PatentTitleYear
10,714,531Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same202010,170,675P--N separation metal fill for flip chip LEDs201910,170,653Tunneling barrier infrared detector devices201910,121,921Tunneling barrier infrared detector devices201810,121,922Tunneling barrier infrared detector devices20189,887,307'Diode barrier infrared detector devices and barrier superlattice structures'20189,755,124'LED module with high index lens'20179,722,161'P-n separation metal fill for flip chip LEDs'20179,722,137'LED having vertical contacts redistributed for flip chip mounting'20179,660,164'Light emitting device with reduced epi stress'20179,548,408'Tunneling barrier infrared detector devices'20179,515,210'Diode barrier infrared detector devices and superlattice barrier structures'20169,385,285'LED module with high index lens'20169,246,061'LED having vertical contacts redistruted for flip chip mounting'20169,219,209'P-N separation metal fill for flip chip LEDs'20159,196,769'Superlattice structures and infrared detector devices incorporating the same'20159,093,630'Light emitting device with reduced EPI stress'20158,912,049'PEC biasing technique for LEDs'20148,400,064'Zener diode protection network in submount for LEDs connected in series'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2016Patents assigned to WEI YAJUN (6)· patent assignee history
2013–2017Based in Sunnyvale, CA, US· patent location history
2014–2016Patents assigned to KONINKL PHILIPS NV (4)· patent assignee history
2015–2019Based in Cincinnati, OH, US· patent location history
2015–2017Based in Loveland, OH, US· patent location history
2015–2016Based in Eindhoven, NL· patent location history
2016–2019Patents assigned to LUMILEDS LLC (3)· patent assignee history
2017Patents assigned to KONINKLIJKE PHILIPS NV (4)· patent assignee history
2017–2020Based in San Jose, CA, US· patent location history
2018–2020Patents assigned to L3 CINCINNATI ELECTRONICS CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WEI YAJUNself | 6 | 2013–2016 |
| KONINKL PHILIPS NV | 4 | 2014–2016 |
| KONINKLIJKE PHILIPS NV | 4 | 2017 |
| L3 CINCINNATI ELECTRONICS CORP | 4 | 2018–2020 |
| LUMILEDS LLC | 3 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cincinnati, OH, US | 7 | 2015–2019 |
| San Jose, California, US | 4 | 2017–2020 |
| Sunnyvale, California, US | 3 | 2013–2017 |
| Loveland, OH, US | 2 | 2015–2017 |
| Eindhoven, NL | 2 | 2015–2016 |