Inventor

CHUNLEI ZHANG

Inventor
US

Overview

41→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 41 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H01LSemiconductor devices11%
H01JElectric discharge tubes or discharge lamps10%
G10LSpeech analysis techniques or speech synthesis8%
C23CCoating metallic material7%
G05BControl or regulating systems in general6%
G06NComputing arrangements based on specific computational models6%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes3%
G09GArrangements or circuits for control of indicating devices using static means to present variable information3%
H04WWireless communication networks3%
PatentTitleYear
12,585,232Substrate support characterization to build a digital twin202612,586,590Techniques for improved zero-shot voice conversion with a conditional disentangled sequential variational auto-encoder202612,586,524Pixel circuit and display panel202612,506,024—202512,496,685Abrasive water jet nozzle for strengthening202512,494,648Control method of energy storage apparatus, energy storage apparatus, and photovoltaic power generation system202512,488,751Pixel circuit and display panel202512,476,081Methods and apparatus for processing a substrate202512,475,914Conditional factorization for jointly modeling code-switched and monolingual ASR202512,467,139Multizone flow distribution system202512,442,765Transmission corrected plasma emission using in-situ optical reflectometry202512,431,074Driving method and apparatus of display panel, and display device202512,417,468User engagement modeling for engagement optimization202512,354,594Techniques for disentangled variational speech representation learning for zero-shot voice conversion202512,339,645Estimation of chamber component conditions using substrate measurements202512,321,188Neuralecho: a self-attentive recurrent neural network for unified acoustic echo suppression, speaker aware speech enhancement and automatic gain control202512,277,939Progressive contrastive learning framework for self-supervised speaker verification202512,278,094Methods and apparatus for processing a substrate202512,272,575Advanced temperature control for wafer carrier in plasma processing chamber2025D1065316Paper cutter202512,235,624Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing202512,216,455Chamber component condition estimation using substrate measurements202512,198,677Techniques for end-to-end speaker diarization with generalized neural speaker clustering202512,159,620Text to speech synthesis without using parallel text-audio data202412,057,333Metrology slot plates202412,031,910Transmission corrected plasma emission using in-situ optical reflectometry202411,948,826High power electrostatic chuck design with radio frequency coupling202411,902,757Techniques for unified acoustic echo suppression using a recurrent neural network202411,837,479Advanced temperature control for wafer carrier in plasma processing chamber2023D1006869Paper cutter2023D1000514Paper cutter202311,765,584Message processing method and system, and user plane function device202311,622,419Azimuthally tunable multi-zone electrostatic chuck202311,532,497High power electrostatic chuck design with radio frequency coupling202211,470,948Convertible combination of attire and backpack with network communication and intelligent sensing features202211,412,623Display screens, display devices integrated with the same, and cover plates202211,368,904Network slice selection method and apparatus202211,364,627Joint support structure of a robot and a robot having the same202211,364,642Waist joint of humanoid robot and humanoid robot2022D0948689Dehumidifier202211,164,723Methods and apparatus for etching semiconductor structures2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to APPLIED MATERIALS INC (17)· patent assignee history
2021–2026Based in US· patent location history
2022Patents assigned to BEIJING INSTITUTE TECH (2)· patent assignee history
2022–2026Based in CN· patent location history
2022Based in CA· patent location history
2023–2025Patents assigned to Ningbo jielisi stationery co ltd (3)· patent assignee history
2024–2026Patents assigned to Tencent America LLC (8)· patent assignee history
2025–2026Patents assigned to HEFEI VISIONOX TECH CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC172021–2026
Tencent America LLC82024–2026
Ningbo jielisi stationery co ltd32023–2025
BEIJING INSTITUTE TECH22022
HEFEI VISIONOX TECH CO LTD22025–2026
Locations
LocationPatentsSpan
US262021–2026
CN142022–2026
CA12022