Inventor
DENNY JOHN
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B22Fprimary
B22FWorking metallic powder16%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering16%
B82YSpecific uses or applications of nanostructures16%
C22CAlloys16%
Y02PClimate change mitigation technologies in the production or processing of goods16%
H01GCapacitors11%
B05BSpraying apparatus5%
C23CCoating metallic material5%
PatentTitleYear
12,198,855Systems and methods for patterning valve metals202512,142,429Systems and methods for patterning valve metals202412,103,071Boron nitride nanotube aluminum composites and methods of manufacturing the same202412,065,743Cold spray deposition of lunar regolith simulant-containing coatings for space repair applications202412,005,497Boron nitride nanotube aluminum composites and methods of manufacturing the same202411,958,108Boron nitride nanotube aluminum composites and methods of manufacturing the same2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to THE FLORIDA INTERNATIONAL UNIV BOARD OF TRUSTEES (6)· patent assignee history
2024–2025Patents assigned to AGARWAL ARVIND (3)· patent assignee history
2024–2025Patents assigned to JOHN DENNY (3)· patent assignee history
2024–2025Patents assigned to ZHANG CHENG (3)· patent assignee history
2024–2025Patents assigned to BANERJEE RESHMI (2)· patent assignee history
2024–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| THE FLORIDA INTERNATIONAL UNIV BOARD OF TRUSTEES | 6 | 2024–2025 |
| AGARWAL ARVIND | 3 | 2024–2025 |
| JOHN DENNYself | 3 | 2024–2025 |
| ZHANG CHENG | 3 | 2024–2025 |
| BANERJEE RESHMI | 2 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2024–2025 |