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Inventor

Boydd Piper

Inventor
Eau Claire, WI, US

Overview

3→
Patents
1994–1999
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification30%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
PatentTitleYear
5,882,459'Method for aligning and laminating substrates to stiffeners in electrical circuits'19995,853,517'Method for coining solder balls on an electrical circuit package'19985,276,955'Multilayer interconnect system for an area array interconnection using solid state diffusion'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to SUPERCOMPUTER SYSTEMS LTD (1)· patent assignee history
1994–1999Based in Eau Claire, WI, US· patent location history
1998–1999Patents assigned to GORE & ASS (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GORE & ASS21998–1999
SUPERCOMPUTER SYSTEMS LTD11994
Locations
LocationPatentsSpan
Eau Claire, WI, US31994–1999