Inventor
Liwen Li
Inventor
Troy, MI, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B62Dprimary
B62DMotor vehicles19%
B81BMicrostructural devices or systems, e.g. micromechanical devices13%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
H02NElectric machines not otherwise provided for13%
H04BTransmission13%
H04JMultiplex communication13%
H04LTransmission of digital information, e.g. telegraphic communication13%
H04WWireless communication networks6%
PatentTitleYear
10,875,579Multiple stage deformation reinforcement structure for impact absorption202010,513,431Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof201910,183,699Multiple stage deformation reinforcement structure for impact absorption201910,173,727Multiple stage deformation reinforcement structure for impact absorption201910,081,541Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof20188,867,443'Method and apparatus for estimating frequency deviation'20148,867,522'Receiving apparatus and method for multi-frame synchronization'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014Patents assigned to CHU JINTAO (2)· patent assignee history
2014Patents assigned to LI LIWEN (2)· patent assignee history
2014Patents assigned to LI QIANG (2)· patent assignee history
2014Based in Shenzhen, CN· patent location history
2014Based in Shenzhen, Guangdong Province, CN· patent location history
2018–2019Patents assigned to HANGZHOU SILAN INTEGRATED CIRCUIT CO LTD (2)· patent assignee history
2018–2019Based in Hangzhou, CN· patent location history
2019–2020Patents assigned to ZEPHYROS INC (3)· patent assignee history
2019–2020Based in Troy, MI, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ZEPHYROS INC | 3 | 2019–2020 |
| CHU JINTAO | 2 | 2014 |
| HANGZHOU SILAN INTEGRATED CIRCUIT CO LTD | 2 | 2018–2019 |
| LI LIWENself | 2 | 2014 |
| LI QIANG | 2 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Troy, MI, US | 3 | 2019–2020 |
| Hangzhou, CN | 2 | 2018–2019 |
| Shenzhen, CN | 1 | 2014 |
| Shenzhen, Guangdong Province, CN | 1 | 2014 |