Inventor
HENNING BRAUNISCH
Inventor
US
Overview
Patents· 51 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01PWaveguides11%
H10DInorganic electric semiconductor devices8%
H05KPrinted circuits6%
H04BTransmission4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G02BOptical elements, systems or apparatus2%
H04LTransmission of digital information, e.g. telegraphic communication1%
B82YSpecific uses or applications of nanostructures1%
PatentTitleYear
12,581,968Package architecture of large dies using quasi-monolithic chip layers202612,581,938Package architecture for quasi-monolithic chip with backside power202612,550,768Conformal power delivery structures near high-speed signal traces202612,520,506In situ inductor structure in buildup power planes202612,519,073Conformal power delivery structures of 3D stacked die assemblies202612,494,443Substrate integrated thin film capacitors using amorphous high-k dielectrics202512,487,420Apparatus and method of manufacturing a vertically disaggregated photonic device202512,489,032Cooling of conformal power delivery structures202512,255,158Components for millimeter-wave communication202512,255,225Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes202512,242,290Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures202512,205,902High-density interconnects for integrated circuit packages202512,199,067Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same202512,176,323Microelectronic assemblies202412,170,244High-throughput additively manufactured power delivery vias and traces202412,166,261Components for millimeter-wave communication202412,150,271Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device202412,126,068Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials202412,126,067Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material202412,113,026Multi-chip package and method of providing die-to-die interconnects in same202412,107,314Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad202412,088,360Dispersive waveguide crosstalk mitigation202412,087,682Power delivery structures202412,021,289Components for millimeter-wave communication202411,955,684Components for millimeter-wave communication202411,916,604Dispersion compensation for electromagnetic waveguides202411,881,457Semiconductor packaging with high density interconnects202411,876,053Multi-chip package and method of providing die-to-die interconnects in same202411,824,008Multi-chip package and method of providing die-to-die interconnects in same202311,804,455Substrate integrated thin film capacitors using amorphous high-k dielectrics202311,791,528Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line202311,764,452Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity202311,756,948In situ package integrated thin film capacitors for power delivery202311,728,290Waveguide fan-out202311,721,649Microelectronic assemblies202311,715,693Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture202311,716,826Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device202311,664,303Interconnection structure fabrication using grayscale lithography202311,605,603Microelectronic package with radio frequency (RF) chiplet202311,581,272Contactless high-frequency interconnect202311,495,552Substrate integrated thin film capacitors using amorphous high-k dielectrics202211,460,499Dual sided thermal management solutions for integrated circuit packages202211,393,777Microelectronic assemblies202211,387,188High density interconnect structures configured for manufacturing and performance202211,387,187Embedded very high density (VHD) layer202211,380,624Electromagnetic interference shield created on package using high throughput additive manufacturing202211,348,897Microelectronic assemblies202211,329,359Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities202211,329,358Low loss and low cross talk transmission lines having l-shaped cross sections202211,282,800Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials202211,222,847Enabling long interconnect bridges2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (50)· patent assignee history
2022–2026Based in US· patent location history
2024Patents assigned to TAHOE RES LTD (1)· patent assignee history
2026Patents assigned to INTE CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 50 | 2022–2026 |
| INTE CORP | 1 | 2026 |
| TAHOE RES LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 51 | 2022–2026 |