Inventor
WEIPING LI
Inventor
CN
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
F04DNon-positive-displacement pumps9%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light7%
G01SRadio direction-finding4%
A61BDiagnosis3%
A61MDevices for introducing media into, or onto, the body3%
F25BRefrigeration machines, plants or systems3%
G01BMeasuring length, thickness or similar linear dimensions3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
12,500,203Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly2025D1098390Wearable air conditioner202512,431,465Chip package and method of forming chip packages202512,413,043Self-mixing interference device with tunable microelectromechanical system202512,406,964Chip package and method of forming chip packages202512,368,124Method for forming semiconductor package and semiconductor package202512,362,327Method of forming packages of stacked chips202512,345,529Self-mixing interference device for sensing applications202512,293,986Method for forming chip packages and a chip package202512,270,736DGT passive sampling device and method for water body detection202512,224,267Chip interconnecting method, interconnect device and method for forming chip packages202512,218,090Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly202512,159,850Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly202412,152,595Portable blowing device202412,154,884Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly2024D1049355Neck air conditioner202412,125,776Method for forming semiconductor package and semiconductor package202412,087,734Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chip2024D1041743Electronic atomizing device202412,087,737Method of forming chip package having stacked chips202412,060,893Portable blowing device202412,046,525Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly202411,973,061Chip package including stacked chips and chip couplers202411,955,396Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly202411,873,825Portable blowing device202411,819,610Visual laryngeal mask2023D0986540Shoe202311,624,370Portable blowing device202311,549,799Self-mixing interference device for sensing applications202311,517,693Visual laryngeal mask202211,463,031Closed-loop stepper motor control system, drive device and automation device202211,418,010VCSEL array with tight pitch and high efficiency202211,319,960Portable temperature regulation device202211,322,630Monolithic infrared transceiver202211,187,241Portable blowing device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to SHENZHEN LANHE TECH CO LTD (8)· patent assignee history
2021–2025Based in CN· patent location history
2022–2025Patents assigned to APPLE INC (5)· patent assignee history
2022–2023Patents assigned to ZHEJIANG UE MEDICAL CORP (2)· patent assignee history
2022Patents assigned to CHINA LEADSHINE TECH CO LTD (1)· patent assignee history
2022–2025Based in US· patent location history
2024–2025Patents assigned to YIBU SEMICONDUCTOR CO LTD (16)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YIBU SEMICONDUCTOR CO LTD | 16 | 2024–2025 |
| SHENZHEN LANHE TECH CO LTD | 8 | 2021–2025 |
| APPLE INC | 5 | 2022–2025 |
| ZHEJIANG UE MEDICAL CORP | 2 | 2022–2023 |
| CHINA LEADSHINE TECH CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 30 | 2021–2025 |
| US | 5 | 2022–2025 |