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Inventor

Yutaka Satou

Inventor
Ichihara, JP

Overview

26→
Patents
2008–2021
Patent span
Chemistry
Primary field (CPC C)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds18%
C08LCompositions of macromolecular compounds13%
H05KPrinted circuits13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H01LSemiconductor devices10%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
Y10TTechnical subjects covered by former us classification5%
C07DHeterocyclic compounds3%
C08JWorking-up3%
C07CAcyclic or carbocyclic compounds3%
PatentTitleYear
11,053,384Curable composition and cured product thereof202110,800,914Active ester composition and cured product thereof202010,741,464Active ester resin and cured product thereof202010,615,156Power module202010,435,382Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board201910,113,028Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article201810,081,585Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board201810,011,676Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board20189,902,798'Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board'20189,890,237'Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board'20189,765,173'Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board'20179,736,926'Epoxy resin, curable resin composition, cured product thereof, and printed circuit board'20179,580,634'Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant'20179,125,309'Epoxy resin, curable resin composition and cured product thereof, and printed wiring board'20159,056,990'Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board'20159,045,508'Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board'20158,519,065'Epoxy compound, curable composition, and cured product thereof'20138,512,466'Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board'20138,394,911'Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board'20138,360,752'Electric compressor'20138,263,714'Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin'20128,168,731'Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same'20127,985,822'Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin'20117,835,188'Semiconductor memory device'20107,440,267'Electronic apparatus'20087,349,201'Electronic apparatus'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008Patents assigned to FUJITSU LTD (2)· patent assignee history
2008Based in Kawasaki, JP· patent location history
2010–2018Based in Chiba, JP· patent location history
2011–2021Patents assigned to DAINIPPON INK & CHEMICALS (21)· patent assignee history
2011–2012Based in Sakura, JP· patent location history
2012–2015Patents assigned to SATOU YUTAKA (8)· patent assignee history
2012–2013Patents assigned to ARITA KAZUO (3)· patent assignee history
2012–2021Based in Ichihara, JP· patent location history
2013–2020Patents assigned to CALSONIC KANSEI CORP (2)· patent assignee history
2013–2020Based in Saitama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DAINIPPON INK & CHEMICALS212011–2021
SATOU YUTAKAself82012–2015
ARITA KAZUO32012–2013
CALSONIC KANSEI CORP22013–2020
FUJITSU LTD22008
Locations
LocationPatentsSpan
Ichihara, JP182012–2021
Saitama, JP22013–2020
Chiba, JP22010–2018
Sakura, JP22011–2012
Kawasaki, JP22008