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Inventor

Keiji Nomaru

Inventor
Tokyo, JP

Overview

66→
Patents
2007–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 66 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering37%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
G01BMeasuring length, thickness or similar linear dimensions10%
H01LSemiconductor devices8%
G02BOptical elements, systems or apparatus3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
B24BMachines, devices, or processes for grinding or polishing1%
PatentTitleYear
11,090,762Laser processing apparatus202111,090,766Laser processing apparatus202111,088,674Saw filter manufacturing method and saw filter202111,065,717Laser processing apparatus202111,054,246Thickness measuring apparatus202111,027,371Laser applying mechanism202111,032,456Ultrafast imaging apparatus202111,015,919Thickness measuring apparatus202111,007,605Laser processing apparatus202110,978,318Laser processing apparatus202110,955,233Thickness measuring apparatus202110,940,560Laser processing apparatus202110,890,433Interferometric thickness measuring apparatus using multiple light sources coupled with a selecting means202110,610,965Laser processing apparatus and method of forming through-hole202010,557,704Non-destructive detection method202010,504,783Laser processing apparatus201910,207,369Method for forming a laser processed hole201910,132,619Spot shape detection apparatus20189,802,270'Laser machining apparatus'20179,796,049'Laser processing apparatus'20179,789,567'Laser beam spot shape detection method'20179,470,516'Unevenness detecting device'20169,358,637'Laser beam spot shape detecting method'20169,289,853'Laser beam applying apparatus'20169,289,857'Laser processing apparatus'20169,285,211'Height detecting apparatus'20169,193,008'Laser processing method and laser processing apparatus'20159,186,749'Laser processing apparatus'20159,186,750'Laser processing apparatus'20159,156,108'Laser machining apparatus'20159,156,109'Laser processing apparatus'20159,108,268'Laser processing apparatus'20159,085,046'Laser beam applying mechanism and laser processing apparatus'20159,087,914'Wafer processing method'20158,941,030'Laser processing apparatus'20158,847,108'Laser beam machining apparatus with detection laser beam oscillator'20148,779,325'Laser beam processing machine'20148,766,137'Laser processing apparatus'20148,581,144'Laser processing apparatus and laser processing method'20138,513,566'Laser beam processing machine'20138,487,208'Laser beam irradiation apparatus and laser working machine'20138,404,999'Laser processing apparatus'20138,378,257'Laser processing apparatus'20138,319,143'Laser processing apparatus'20128,143,552'Laser beam machining system'20128,124,909'Laser processing apparatus'20128,049,134'Laser processing machine'20118,040,520'Device for detecting the edges of a workpiece, and a laser beam processing machine'20117,994,452'Laser beam machining apparatus'20117,978,408'Polarizing device and laser unit'20117,932,478'Laser processing machine'20117,714,249'Laser beam processing machine'20107,675,002'Laser beam processing machine'20107,589,332'Via-hole processing method'20097,580,136'Height position detector for work held on chuck table'20097,564,570'Height position detector for work held on chuck table'20097,544,587'Wafer dividing method and wafer dividing apparatus'20097,538,048'Laser beam processing machine'20097,499,185'Measuring device for workpiece held on chuck table'20097,482,553'Laser beam processing machine'20097,471,384'Via hole depth detector'20087,459,655'Laser beam processing machine'20087,443,517'Measuring instrument and laser beam machine for wafer'20087,428,062'Measuring apparatus for work held by chuck table, and laser beam machining apparatus'20087,402,773'Laser beam processing machine'20087,307,233'Isotope separation method and working substance for isotope separation'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007Based in Kashiwa, JP· patent location history
2008–2021Patents assigned to DISCO CORP (65)· patent assignee history
2008–2021Based in Tokyo, JP· patent location history
2008–2016Based in Ota, JP· patent location history
2012–2016Patents assigned to NOMARU KEIJI (17)· patent assignee history
2012–2013Patents assigned to SAWABE TAIKI (2)· patent assignee history
2013–2015Patents assigned to MORIKAZU HIROSHI (4)· patent assignee history
2013–2014Patents assigned to KOBAYASHI YUTAKA (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DISCO CORP652008–2021
NOMARU KEIJIself172012–2016
MORIKAZU HIROSHI42013–2015
KOBAYASHI YUTAKA22013–2014
SAWABE TAIKI22012–2013
Locations
LocationPatentsSpan
Tokyo, JP412008–2021
Ota, JP242008–2016
Kashiwa, JP12007