Inventor
Roy Dale Hollaway
Inventor
Chandler, AZ, US
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation19%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
H04NPictorial communication, e.g. television4%
G11CStatic stores3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
G02BOptical elements, systems or apparatus3%
PatentTitleYear
7,609,461'Optical module having cavity substrate'20097,059,040'Optical module with lens integral holder fabrication method'20066,967,395'Mounting for a package containing a chip'20056,962,829'Method of making near chip size integrated circuit package'20056,943,429'Wafer having alignment marks extending from a first to a second surface of the wafer'20056,869,861'Back-side wafer singulation method'20056,849,916'Flip chip on glass sensor package'20056,816,523'VCSEL package and fabrication method'20046,777,789'Mounting for a package containing a chip'20046,765,801'Optical track drain package'20046,734,419'Method for forming an image sensor package with vision die in lens housing'20046,730,536'Pre-drilled image sensor package fabrication method'20046,717,126'Method of fabricating and using an image sensor package with reflector'20046,686,588'Optical module with lens integral holder'20046,686,580'Image sensor package with reflector'20046,670,698'Integrated circuit package mounting'20036,661,080'Structure for backside saw cavity protection'20036,638,789'Micromachine stacked wirebonded package fabrication method'20036,627,864'Thin image sensor package'20036,627,987'Ceramic semiconductor package and method for fabricating the package'20036,624,921'Micromirror device package fabrication method'20036,610,167'Method for fabricating a special-purpose die using a polymerizable tape'20036,586,824'Reduced thickness packaged electronic device'20036,580,167'Heat spreader with spring IC package'20036,580,153'Structure for protecting a micromachine with a cavity in a UV tape'20036,571,466'Flip chip image sensor package fabrication method'20036,572,944'Structure for fabricating a special-purpose die using a polymerizable tape'20036,562,655'Heat spreader with spring IC package fabrication method'20036,548,759'Pre-drilled image sensor package'20036,545,345'Mounting for a package containing a chip'20036,530,515'Micromachine stacked flip chip package fabrication method'20036,532,157'Angulated semiconductor packages'20036,528,869'Semiconductor package with molded substrate and recessed input/output terminals'20036,528,875'Vacuum sealed package for semiconductor chip'20036,522,015'Micromachine stacked wirebonded package'20036,515,269'Integrally connected image sensor packages having a window support in contact with a window and the active area'20036,512,219'Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area'20036,486,545'Pre-drilled ball grid array package'20026,455,927'Micromirror device package'20026,420,776'Structure including electronic components singulated using laser cutting'20026,399,463'Method of singulation using laser cutting'20026,399,418'Method for forming a reduced thickness packaged electronic device'20026,396,043'Thin image sensor package fabrication method'20026,342,406'Flip chip on glass image sensor package fabrication method'20026,291,884'Chip-size semiconductor packages'20016,268,654'Integrated circuit package having adhesive bead supporting planar lid above planar substrate'20016,228,676'Near chip size integrated circuit package'20016,117,705'Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate'20006,034,429'Integrated circuit package'20005,981,314'Near chip size integrated circuit package'19995,950,074'Method of making an integrated circuit package'19995,796,163'Solder ball joint'19985,672,909'Interdigitated wirebond programmable fixed voltage planes'19975,482,736'Method for applying flux to ball grid array package'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1997Patents assigned to AMKOR ELECTRONICS INC (2)· patent assignee history
1996–2003Based in Metro Manila, PH· patent location history
1997–2001Based in Paranaque, PH· patent location history
1998–2009Patents assigned to AMKOR TECHNOLOGY INC (52)· patent assignee history
2002–2009Based in Chandler, AZ, US· patent location history
2003–2005Based in Paranague, PH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 52 | 1998–2009 |
| AMKOR ELECTRONICS INC | 2 | 1996–1997 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 38 | 2002–2009 |
| Paranaque, PH | 9 | 1997–2001 |
| Metro Manila, PH | 5 | 1996–2003 |
| Paranague, PH | 2 | 2003–2005 |