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Inventor

Min-San Huang

Inventor
Hsinchu, TW

Overview

20→
Patents
2001–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H10BElectronic memory devices13%
G11CStatic stores8%
G06FElectric digital data processing5%
H04LTransmission of digital information, e.g. telegraphic communication5%
A22CProcessing meat, poultry, or fish3%
A41DOuterwear3%
D03DWoven fabrics3%
D06QDecorating textiles3%
PatentTitleYear
11,079,881Signal processing circuit and system202111,055,517Non-contact human input method and non-contact human input system20218,769,287'Method, system, and device for obtaining keys'20148,549,286'Method and system for forwarding data between private networks'20138,486,509'Patterns having variable colors'20137,803,692'Manufacturing method of semiconductor device having self-aligned contact'20107,612,433'Semiconductor device having self-aligned contact'20097,575,027'Weave with visual color variation'20097,550,372'Method of fabricating conductive lines with silicide layer'20097,368,373'Method for manufacturing semiconductor devices and plug'20087,205,217'Method for forming trench gate dielectric layer'20077,195,982'Method for manufacturing anti-punch through semiconductor device'20077,166,513'Manufacturing method a flash memory cell array'20077,098,124'Method of forming contact hole and method of fabricating semiconductor device'20067,057,940'Flash memory cell, flash memory cell array and manufacturing method thereof'20066,972,260'Method of fabricating flash memory cell'20056,913,974'Flash memory device structure and manufacturing method thereof'20056,911,690'Flash memory cell, flash memory cell array and manufacturing method thereof'20056,770,934'Flash memory device structure and manufacturing method thereof'20046,236,114'Bonding pad structure'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2010Based in Hsinchu, TW· patent location history
2004–2010Patents assigned to POWERCHIP SEMICONDUCTOR CORP (12)· patent assignee history
2009–2013Patents assigned to HUANG MIN-SAN (2)· patent assignee history
2009Based in Tsinchu, TW· patent location history
2013–2014Patents assigned to CHENGDU HUAWEI SYMANTEC TECH (2)· patent assignee history
2013–2014Patents assigned to HUANG MIN (2)· patent assignee history
2013–2014Patents assigned to LIU LIFENG (2)· patent assignee history
2013–2014Based in Chengdu, CN· patent location history
2013Based in Taipei, TW· patent location history
2021Based in Taoyuan County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
POWERCHIP SEMICONDUCTOR CORP122004–2010
CHENGDU HUAWEI SYMANTEC TECH22013–2014
HUANG MINself22013–2014
HUANG MIN-SANself22009–2013
LIU LIFENG22013–2014
Locations
LocationPatentsSpan
Hsinchu, TW132001–2010
Taoyuan County, TW22021
Chengdu, CN22013–2014
Taipei, TW12013
Tsinchu, TW12009