Inventor

Hidefumi Nakamura

Inventor
Hachinohe, JP

Overview

17→
Patents
2015–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder19%
C22CAlloys10%
H03HImpedance networks, e.g. resonant circuits6%
H05KPrinted circuits6%
Y10TTechnical subjects covered by former us classification6%
A61CDentistry5%
C04BLime, magnesia5%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08LCompositions of macromolecular compounds5%
H01LSemiconductor devices5%
PatentTitleYear
10,912,155Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate202110,848,016Magnetic powder dust core with entirely buried coil or magnet202010,773,302Metal powder for powder metallurgy, compound, granulated powder, and sintered body202010,682,697Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body202010,675,682Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body202010,299,376Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object201910,130,449Dental casting billet material, metal powder for powder metallurgy, dental metal component, and dental prosthesis20189,954,160Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object20189,888,987'Dental blank to be machined, metal powder for powder metallurgy, dental metal frame for porcelain bonding, and dental prosthesis'20189,769,934'Package base, package, electronic device, electronic apparatus, and moving object'20179,655,698'Blank material to be cut for dentistry, metal powder for powder metallurgy, metal frame for porcelain fusing for dentistry, and dental prosthesis'20179,597,767'Polishing media, method for producing polishing media, and polishing method'20179,309,383'Composition for injection molding, sintered compact, and method for producing sintered compact'20169,249,292'Composition for injection molding, sintered compact, and method for producing sintered compact'20169,219,218'Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object'20159,073,121'Method for producing sintered compact'20159,045,632'Method for producing composition for injection molding comprising cryogenic grinding of resin components, and composition for injection molding'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2020Patents assigned to SEIKO EPSON CORP (16)· patent assignee history
2015–2017Patents assigned to ISHIGAMI HIDEKI (2)· patent assignee history
2015–2017Patents assigned to NAKAMURA HIDEFUMI (2)· patent assignee history
2015–2020Based in Hachinohe, JP· patent location history
2017Patents assigned to HAYASHI JUNICHI (1)· patent assignee history
2021Patents assigned to DAINIPPON PRINTING CO LTD (1)· patent assignee history
2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEIKO EPSON CORP162015–2020
ISHIGAMI HIDEKI22015–2017
NAKAMURA HIDEFUMIself22015–2017
DAINIPPON PRINTING CO LTD12021
HAYASHI JUNICHI12017
Locations
LocationPatentsSpan
Hachinohe, JP162015–2020
Tokyo, JP12021