Inventor
Adolf E. Wirsing
Inventor
South Hero, VT, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
B23KSoldering or unsoldering11%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
C23CCoating metallic material5%
PatentTitleYear
7,288,492'Method for forming interconnects on thin wafers'20077,138,326'Wafer integrated rigid support ring'20066,951,775'Method for forming interconnects on thin wafers'20056,706,621'Wafer integrated rigid support ring'20045,719,070'Metallization composite having nickel intermediate/interface'19985,457,345'Metallization composite having nickle intermediate/interface'19955,251,806'Method of forming dual height solder interconnections'19935,130,779'Solder mass having conductive encapsulating arrangement'19925,104,695'Method and apparatus for vapor deposition of material onto a substrate'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2007Patents assigned to IBM (9)· patent assignee history
1992–2007Based in South Hero, VT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 9 | 1992–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| South Hero, VT, US | 9 | 1992–2007 |