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Inventor

Tetsuto Yamagishi

Inventor
Kariya, JP

Overview

6→
Patents
2012–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices27%
H05KPrinted circuits20%
B29CShaping or joining of plastics7%
B29LIndexing scheme associated with subclass b29c, relating to particular articles7%
PatentTitleYear
10,109,557Electronic device having sealed heat-generation element20189,832,872Method for manufacturing electronic device, and electronic device20179,601,442'Half-mold type mold package'20179,087,924'Semiconductor device with resin mold'20158,749,055'Semiconductor device with resin mold'20148,207,607'Semiconductor device with resin mold'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2018Patents assigned to DENSO CORP (6)· patent assignee history
2012–2014Patents assigned to ASAI YASUTOMI (2)· patent assignee history
2012–2014Patents assigned to IMAIZUMI NORIHISA (2)· patent assignee history
2012–2014Patents assigned to NOMURA TOHRU (2)· patent assignee history
2012–2014Patents assigned to YAMAGISHI TETSUTO (2)· patent assignee history
2012–2015Based in Nukata-gun, JP· patent location history
2017–2018Based in Kariya, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DENSO CORP62012–2018
ASAI YASUTOMI22012–2014
IMAIZUMI NORIHISA22012–2014
NOMURA TOHRU22012–2014
YAMAGISHI TETSUTOself22012–2014
Locations
LocationPatentsSpan
Kariya, JP32017–2018
Nukata-gun, JP32012–2015