Inventor
TSUNG-HSING LU
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
12,237,226Dicing method for stacked semiconductor devices202512,205,859Package and printed circuit board attachment202512,051,624Stacked semiconductor devices and methods of forming thereof202411,990,423Magnetic shielding material with insulator-coated ferromagnetic particles202411,610,827Package and printed circuit board attachment202311,404,383Magnetic shielding material with insulator-coated ferromagnetic particles202211,239,143Semiconductor structure and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2025 |