LexDanaLexDanabeta
Inventor

Jason Price

Inventor
Eugene, OR, US

Overview

4→
Patents
2002–2010
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing75%
A41DOuterwear25%
PatentTitleYear
7,730,551'Underarm garment protector'20107,311,586'Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20077,029,382'Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20066,368,189'Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Patents assigned to MITSUBISHI MATERIALS CORP (1)· patent assignee history
2002–2007Based in Eugene, OR, US· patent location history
2006–2007Patents assigned to EBARA CORP (2)· patent assignee history
2010Patents assigned to PRICE JASON ANDREW (1)· patent assignee history
2010Based in New York, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP22006–2007
MITSUBISHI MATERIALS CORP12002
PRICE JASON ANDREWself12010
Locations
LocationPatentsSpan
Eugene, OR, US32002–2007
New York, New York, US12010