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Inventor

Ming Wai Kelvin Ng

Inventor
Hong Kong, CN

Overview

3→
Patents
2006–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B06Bprimary
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general14%
B23KSoldering or unsoldering14%
G06FElectric digital data processing14%
H04LTransmission of digital information, e.g. telegraphic communication14%
H04MTelephonic communication14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
11,044,266Scan adaptation during scan execution20217,240,711'Apparatus and method for alignment of a bonding tool'20077,002,283'Ultrasonic transducer assembly'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2007Patents assigned to ASM ASSEMBLY AUTOMATION LTD (2)· patent assignee history
2006–2021Based in Hong Kong, CN· patent location history
2007Based in Kwai Chung, HK· patent location history
2021Patents assigned to ENTIT SOFTWARE LLC (1)· patent assignee history
2021Patents assigned to MICRO FOCUS LLC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASM ASSEMBLY AUTOMATION LTD22006–2007
ENTIT SOFTWARE LLC12021
MICRO FOCUS LLC12021
Locations
LocationPatentsSpan
Hong Kong, CN22006–2021
Kwai Chung, HK12007