Inventor

Glen N. Biggs

Inventor
Wappingers Falls, NY, US

Overview

18→
Patents
1999–2021
Patent span
Chemistry
Primary field (CPC C)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings59%
B23KSoldering or unsoldering23%
H05KPrinted circuits9%
B22DCasting of metals5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
11,053,604System for treating solution for use in electroplating application and method for treating solution for use in electroplating application202110,895,017Prevent and remove organics from reservoir wells202110,718,062Prevent and remove organics from reservoir wells202010,450,667System for treating solution for use in electroplating application and method for treating solution for use in electroplating application201910,392,720Prevent and remove organics from reservoir wells201910,087,546Prevent and remove organics from reservoir wells201810,053,794Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution20189,777,388'Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution'20179,278,401'Fill head interface with combination vacuum pressure chamber'20168,926,820'Working electrode design for electrochemical processing of electronic components'20158,784,618'Working electrode design for electrochemical processing of electronic components'20148,123,089'Dispensing assembly with an injector controlled gas environment'20128,123,088'Dispensing assembly with a controlled gas environment'20127,513,410'Air bearing gap control for injection molded solder heads'20097,401,637'Pressure-only molten metal valving apparatus and method'20086,241,868'Method for electroplating a film onto a substrate'20016,077,405'Method and apparatus for making electrical contact to a substrate during electroplating'20005,869,139'Apparatus and method for plating pin grid array packaging modules'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2021Patents assigned to IBM (16)· patent assignee history
1999–2021Based in Wappingers Falls, NY, US· patent location history
2012Patents assigned to BIGGS GLEN NELSON (2)· patent assignee history
2014–2015Patents assigned to ARVIN CHARLES L (2)· patent assignee history
2014–2015Patents assigned to BEZAMA RASCHID J (2)· patent assignee history
2014–2015Patents assigned to BIGGS GLEN N (2)· patent assignee history
2014–2015Based in Wappinger Falls, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM161999–2021
ARVIN CHARLES L22014–2015
BEZAMA RASCHID J22014–2015
BIGGS GLEN Nself22014–2015
BIGGS GLEN NELSONself22012
Locations
LocationPatentsSpan
Wappingers Falls, New York, US161999–2021
Wappinger Falls, New York, US22014–2015