Inventor
Terry Tarn
Inventor
San Diego, CA, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification19%
G02BOptical elements, systems or apparatus17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
H01LSemiconductor devices3%
H10HInorganic light-emitting semiconductor devices having potential barriers3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
PatentTitleYear
9,261,696'Micromirror array assembly'20169,056,764'Microelectromechanical device packages with integral heaters'20158,778,741'Low cost hermetically sealed package'20148,693,082'Micromirror array assembly with in-array pillars'20147,872,338'Microelectromechanical device packages with integral heaters'20117,787,170'Micromirror array assembly with in-array pillars'20107,508,063'Low cost hermetically sealed package'20097,449,773'Microelectromechanical device packages with integral heaters'20087,408,250'Micromirror array device with compliant adhesive'20087,402,878'Packaging method for microstructure and semiconductor devices'20087,282,393'Microelectromechanical device packages with integral heaters'20077,164,199'Device packages with low stress assembly process'20077,110,160'Electrical contacts in microelectromechanical devices with multiple substrates'20067,042,623'Light blocking layers in MEMS packages'20065,865,935'Method of packaging image sensors'19995,670,009'Assembly technique for an image sensor array'19975,382,310'Packaging medical image sensors'19955,349,234'Package and method for assembly of infra-red imaging devices'19945,340,420'Method for bonding a color separation filter to an image sensor'19945,337,217'Integrated circuit package for an image sensor'19945,289,002'Optical sensor and method of production'19945,192,835'Bonding of solid state device to terminal board'19935,074,683'Fiber optic faceplates and method of mounting same'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–1999Patents assigned to EASTMAN KODAK CO (9)· patent assignee history
1991–1999Based in Pittsford, NY, US· patent location history
2006Patents assigned to REFLECTIVITY INC (2)· patent assignee history
2006–2016Based in San Diego, CA, US· patent location history
2007–2016Patents assigned to TEXAS INSTRUMENTS INC (12)· patent assignee history
2014–2015Patents assigned to TARN TERRY (3)· patent assignee history
2014Patents assigned to DEHLINGER DIETRICH (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 12 | 2007–2016 |
| EASTMAN KODAK CO | 9 | 1991–1999 |
| TARN TERRYself | 3 | 2014–2015 |
| REFLECTIVITY INC | 2 | 2006 |
| DEHLINGER DIETRICH | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 14 | 2006–2016 |
| Pittsford, New York, US | 9 | 1991–1999 |